Technology for temperature sensitive components in thermal processing

ABSTRACT

For a printed circuit board assembly (“PCBA”) selected electronic components are highlighted on a graphic representation of the PCBA on a display of a computer system. The components are selected responsive to temperature and time limits of the selected components. Ones of the highlighted components are associated to respective temperature sensors on the PCBA. Responsive to where the one or more additional ones of the highlighted components are located on the PCBA relative to the at least one of the respective temperature sensors, one or more additional ones of the highlighted components are associated with at least one of the respective temperature sensors. The computer system receives data for respective signals indicating temperatures encountered by the respective temperature sensors when the PCBA is heated in a manufacturing process. The computer system shows whether any of the time and temperature limits were exceeded during the manufacturing process.

FIELD OF THE INVENTION

The present invention relates to technology for printed circuit boarddesign involving temperature sensitive components.

BACKGROUND

In the manufacturing of electronic devices, a device manufacturer mayprocure electronic components from component manufacturers and attachthe components to a printed circuit board assembly (“PCBA”), wherein thecomponents are appropriately connected together to form operatingcircuits. In this context, a bill of materials (“BOM”) for a printedcircuit board assembly may list electronic components that populate thePCBA.

SUMMARY

According to an embodiment of the invention, a computer systemimplemented method

A method for a PCBA having electronic components includes highlightingselected electronic components on a graphic representation of the PCBAon a display of a computer system. The components are selectedresponsive to temperature and time limits of the selected components.Ones of the highlighted components are associated to respectivetemperature sensors on the PCBA. Responsive to where the one or moreadditional ones of the highlighted components are located on the PCBArelative to the at least one of the respective temperature sensors, oneor more additional ones of the highlighted components are associatedwith at least one of the respective temperature sensors. The computersystem receives data for respective signals indicating temperaturesencountered by the respective temperature sensors when the PCBA isheated in a manufacturing process. The computer system shows whether anyof the time and temperature limits were exceeded during themanufacturing process.

Other embodiments of the invention are disclosed and claimed, includinga computer system implementation and a computer program product.

BRIEF DESCRIPTION OF DRAWINGS

The novel features believed characteristic of the invention are setforth in the appended claims. The invention itself, however, as well asa preferred mode of use, further objectives and advantages thereof, willbest be understood by reference to the following detailed description ofan illustrative embodiment when read in conjunction with theaccompanying drawings, wherein:

FIG. 1 is an exemplary block diagram illustrating a distributed dataprocessing system according to embodiments of the invention.

FIG. 2 is an exemplary block diagram of a server apparatus according toembodiments of the invention.

FIG. 3 is an exemplary block diagram of a client apparatus according toembodiments of the invention.

FIG. 4 illustrates structure of data and instructions for temperaturesensitive component mapping, according to embodiments of the presentinvention.

FIGS. 5A and 5B illustrate a method for temperature sensitive componentmapping, according to embodiments of the present invention.

DETAILED DESCRIPTION

Herein below, information is described, including a BOM, a componentdatabase, component manufacturing standards and physical design data,which are for use by software tools, including a smart questionnaire, aBOM scrub tool, a mapping tool and a monitoring/analysis tool. Accordingto embodiments of the present invention, the information may be providedin digital form and stored on computer readable storage media eitherlocally or remotely from the software tools, so that the tools mayaccess, read from and write to the information either locally or via anetwork.

Referring now to FIG. 4, for embodiments of the present invention, a BOM405, a smart questionnaire 404, and a BOM scrub tool 415 are provided.For a typical component 440, BOM 405 may include information indicatinga manufacturer of a particular component 440 along with themanufacturer's part number for the component 440. BOM 405 may alsoinclude a reference designator (“RD”) for each component 440, whichcorresponds to a reference designator included in physical design data430 provided for the PCBA, which may include an assembly drawing. Thus,the reference designator indicates a location where component 440resides on the PCBA according to physical design data 430. One way thelocation of a component 440 may be indicated is for its referencedesignator to be shown graphically on a layout 435 depicted in theassembly drawing.

The following illustrates a portion of data structure in BOM 405,according to embodiments of the present invention:

.Reference Part Number Manufacturer Designator(s) . . . 112234 AlfaC101, C102, C103 7589461 Bravo R001, R002 3850188 Charlie U1201. . . . .. . . . .

Besides identifiers for components 440 on a PCBA 520, each PCBA 520 mayitself have an identifier, such as a part number, to distinguish it fromother types of PCBA's. A BOM 405 for a particular type of PCBA may alsoinclude that PCBA's identifier.

Physical design data 430 may include, for example, a .brd file formattedaccording to an Allegro design environment. (“Allegro” is a trademark ofCadence Design Systems, Inc.) Other formats may also be supported.Physical design data 430 provides a physical design environment thatincludes a physical design software program for creating layouts ofPCBA's. That is, as the term “physical design data” is used here, it mayinclude the physical design software program.

The following illustrates structure of a portion of data in physicaldesign data 430, which indicates locations of components by theirrespective reference designators and coordinates, for example, accordingto embodiments of the present invention:

Reference Designator x-y Location Part number C101 2945.000 935.000112234 R001 4955.000 1475.000 7589461 U1201 882.500 3997.500 850188 . .. . . . . . .

Also according to embodiments of the present invention, a component 440database 410 is compiled and provided from information published bycomponent 440 manufacturers on industry standard or manufacturerspecific forms 406 or from information obtained by communication withcomponent 440 manufacturers. According to one method, this includesexecuting a smart questionnaire 404, which includes a user interfaceconfigured to prompt a user 450 to enter the information aboutcomponents 440 that may be used for PCBA's into a data structure, whichdatabase 410 receives, including part number, manufacturer andtemperature specifications, for example, which may include limitsregarding the maximum amount of time each component can withstand agiven temperature. User 450 who enters component data via smartquestionnaire 404 may be a component engineer, for example.

Further, smart questionnaire 404 is configured to perform an auto loadfunction, by which smart questionnaire 404 accesses computer readabledata forms 406 provided by component manufacturers. Smart questionnaire404 is also configured to evaluate the data entered against valuesspecified in industry standards or by user 450 to ensure that theprovided values are appropriate or within an expected range.

In another aspect, according to embodiments of the present invention,the information gathered in a data structure of the smart questionnaire404 from component 440 supplier is transferred manually or via anautomated software process into database 410, such as by a commandalready supported by database 410 or else written for the data structureof smart questionnaire 404. The information received, such as via smartquestionnaire 404, and transferred to database 410 categorizes component440 environmental limits, such that the categories indicate particularprocesses to which the temperature, time at temperature, ramp rate, andreflow limits are applicable, such as i) initial component 440 solderattach, for example, which may be further categorized according to typeof soldering, such as soldering for surface mount technology (“SMT”) orwave soldering, which is for plated through hole (“PTH”) technology, andii) so-called “post-attach” processes, including, but not limited to,moisture bake of assembled printed circuit board, preheat of assembledprinted circuit board prior to SMT or PTH rework, and adhesive or epoxycure of assembled printed circuit board. Processes may include surfacemount reflow, vapor phase reflow, wave solder, hot gas rework, localvapor phase rework, solder fountain rework, and manual hand ironmethods.

As a result of user 450 entering information, and as a result ofdatabase 410 receiving and storing the information, as described above,database 410 contains information that indicates for each component 440,according to its part number, the capability of that part number towithstand specified processing conditions for attaching that component440 to a printed circuit board assembly, such as PCBA 520 in FIG. 4, andto withstand processes performed on PCBA 520 assembly after component440 has been attached per conditions specified i) in an industrystandard and/or ii) documented by user 450. The resulting component 440capability information stored in database 410 states temperature andduration limits along with other processing limitations. Examplesinclude time at temperature, ramp rate, and reflow limits that acomponent 440 can withstand.

Once this information has been included in database 410, then database410 has part numbers, manufacturer and temperature specifications forcomponents 440 that may be used for a PCBA, such as PCBA 520, and may bea source for looking up temperature-related limit information responsiveto a component 440 part number.

Temperature sensitive component report generation software applicationmodule 415A of scrub tool 415 is configured to receive a set of partnumbers, such as by importing the set of part numbers as a file 403,which may be generated via user 450 manually entry, where user 450 readsthe part numbers from a BOM 405 for a particular PCBA 520. Scrub toolmodule 415A is configured, according to embodiments of the presentinvention, to alternatively import the set of part numbers from BOM 405by including a software application module 415B that reads a BOM 405data structure, e.g., file, extracts the set of part numbers andpresents them as a part number list, such as in the form of a text file403, for example.

Temperature sensitive component report generation software applicationmodule 415A of scrub tool 415 also provides a database 410 query andreport generation capability, by which a user 450 may request fromdatabase 410 temperature sensitive data for each part number in aparticular PCBA responsive to the part number list 403 manually input orimported from a file by user 450. Responsive to such a request, module415A generates a temperature sensitive component report 420A providingtemperature specification data for each requested part number on list403. (Typically user 450 who queries database 410 for such temperaturespecifications is a user concerned with controlling a PCBA manufacturingprocess, rather than a component engineer.)

Software application module 415B provides a temperature sensitivecomponent optimization tool that imports temperature sensitive componentreport data 420A generated by module 415A. Module 415B also accesses BOM405 file to extract reference designators for the part numbers listedtherein, which module 415B merges with report 420A to generate report420B that includes a reference designator along with part number foreach component 440 of list 403. Module 415B is configured to also sortand filter the components 440 in list 403 of temperature sensitivecomponent report 420A responsive to a user 450 query, wherein the sortedand filtered query result from module 415B is presented as a report420B, as further described herein below.

It should be appreciated from the foregoing that for each component 440listed in BOM 405, scrub tool module 415A looks up in database 410 therelevant temperature, time at temperature, ramp rate, reflow limits andother requirements and then provides this information in report 420A forall parts listed in BOM 405. Scrub tool module 415B is configured togenerate reports 420B listing components 440 that are sensitive toparticular processes, for example, where the generating may beresponsive to a request received by module 415B from a user 450 whoserequest specifies the process of interest.

Generating a report 420B listing components 440 sensitive to aparticular process may include module 415B sorting the list ofcomponents 440, such that components 440 having part numbers sensitiveto a specified process are grouped together and presented at the top ofa list of components 440, and may include sorting within manufacturingprocess categories such that components 440 whose part numbers havelowest temperature-withstand capability are listed first within eachtype of process category. For example, the table below illustrates aportion of data from report 420B sorted for SMT process sensitivecomponents. Part numbers for user 450 selected types of components 440in report 420B are input to map tool 425 by user 450, according toembodiments of the present invention. For example, user 450 may selectcomponents 440 whose part numbers are most sensitive to a specifiedprocess, which are presented together at the top of a list in report420B generated responsive to a query via module 415B by user 450 for thespecified process.

SMT Part Reference Process Number Designator Manufacturer Sensitive?Process Limit 566254 C608 Bravo YES Peak Temp = 245 C. max 758594 R102Bravo YES Time above 217 C. = 30 sec max 112234 C101 Alfa YES Number ofreflow cycles = 2

Herein, reference is made to component 440 “types.” An example of acomponent 440 functional type includes a discrete component, such as aresistor, capacitor, transistor, diode, etc. and an integrated circuitor assembly component, such as a processor, ASIC, crystal, filter, DRAM,SRAM, display, power regulator, buffer, etc. A PCBA may have components440 of different part numbers that are the same functional type ofcomponent 440. Generally, however, according to embodiments of thepresent invention, reference herein to a component “type” concernscomponents 440 having a particular part number.

Scrub tool 415 module 415B is further configured to generate reports420B that present components 440 sorted by component 440 referencedesignators, part numbers or component 440 types, which may includegenerating a report 420B showing components 440 that are missing partnumbers, according to embodiments of the present invention. (A missingpart number may mean that some data for that part number is missing indatabase 410, e.g., data from a component manufacturer, and prompts user450 to contact a component engineer responsible for that part number toobtain temperature sensitive component information from the componentmanufacturer and to then enter the information into database 410.)

In another aspect, according to embodiments of the present invention, amapping tool 425 is provided, which is configured to generate a datastructure 427, such as a file, for a physical design software tool 432to read, such as by user 450 initiated importing to tool 432 orotherwise. A software module added to the program of physical designdata 430 provides tool 432. Data structure 427 identifies components 440that user 450 selected via report 420B for temperature monitoring due totemperature sensitivity of the selected components 440. Data structure427 indicates component 440 type by part number and how that part numberwill be highlighted (color, fill pattern, etc.), as selected by user 450when user 450 inputs selected component 440 part numbers to map tool425.

Physical design data program 430 generates and presents a graphicdepiction 435 of the PCBA layout, e.g., assembly drawing, wherelocations of respective components 440 are indicated at least byoutlines or icons, and may also be shown by respective referencedesignators on graphic layout 435 of PCBA 520. Responsive to data 427generated by mapping tool 425, physical design software tool 432communicates to program 430, indicating a user selected type ofhighlighting for each user selected part number indicated in file 427,so that program 430 responsively presents a modified layout depiction455 that highlights physical locations of the one or more of component440 part numbers selected by user 450 due to their temperaturesensitivity. (The example of FIG. 4 shows only ten components 440highlighted in PCBA 520 layout 455 and shows only 17 components intotal. It should be appreciated however that this illustration issimplified in order to particularly point out certain issues andstructures. PCBA 520 may have many more than 17 components 440 overalland many more than ten selected components 440.) Highlighting physicallocations of the one or more of components 440 selected by user 450 mayinclude hiding depiction of components 440 not selected by user 450.However, according an embodiment of the present invention shown in FIG.4, the highlighting includes presenting the selected components 440 inbold fashion. Alternatively, highlighting may include presenting theselected components 440 in a different color and/or fill pattern thannon-selected components.

In another aspect, user 450 attaches temperature sensing devices 445,such as thermocouples or resistance temperature devices, to components440 selected by user 450. That is, by causing physical design softwaretool 432 to highlight all the instances of components 440 of aparticular one or more part numbers (in different colors and/or shades),this allows a user to see where those particular part numbers arelocated, so the user can make decisions regarding where to best puttemperature sensors 445 to optimize coverage for them. Accordingly, inembodiments of the present invention, user 450 selects components forattaching sensors 445 (i.e., “mounting components,” to which respectivesensors 445 shall be attached) based on information presented to user450 in layout graphic 455, where the information presented includeshighlighted locations of components 440 on PCBA 520 whose part numbersare most temperature sensitive relative to a particular manufacturingprocess. In a particular instance, the manufacturing process may be SMTsoldering, for example. It should be understood that a for a specifictemperature sensitive component 440, printed circuit board assembly 520may have 100 or more components 440 of this part number, so that it istypically not physically possible and/or cost prohibitive to provide atemperature sensing device 445 for each individual component 440.

As previously stated, mapping tool 425 generates data 427 needed fortool 432 to cause the program of physical design data 430 to graphicallyidentify, at their locations on the PCBA 520, those components 440 whosepart numbers are the most temperature sensitive, e.g., most sensitiverelative to a particular manufacturing process. Graphically identifyingthe most temperature sensitive components 440 enables user 450 to selectlocations on PCBA 520 for placement of temperature sensors 445 such thatthere are temperature sensors 445 located proximate to a representativesample of the most temperature sensitive components 440. In the example,ten components 440 are shown, each being the same part number, althoughin other instances the components 440 selected for monitoring bytemperature sensors 445 may be disparate part numbers. Even components440 selected for association with a single sensor 445 may have disparatepart numbers.

Due to graphic depiction 455, user 450 may observe that the highlightedcomponents 440 happen to be grouped in three regions on printed circuitboard assembly 520 in the illustrated instance of FIG. 4, as shown bythe dashed lines shown on layout 455, i.e., a group 460A of threecomponents 440 in the upper left corner, a group 460B of threecomponents 440 in the upper right corner and a group 460C of fourcomponents 440 in the lower right corner. Consequently, user 450 choosesin the illustrated instance to locate a sensor 445 on one of thecomponents 440 in each of these areas as shown. For example, user 450selects three components 440 as a set 460A (shown by dashed lines) andassociates all three of them with a single sensor 445, which is attachedto one of these three components. Likewise, three other components 440are selected as a set 460B (again shown by dashed lines) and associatedwith another sensor 445 located on one of the components in the group460B of three. Finally, four other components 440 are selected as a set460C (once again shown by dashed lines) and associated with anothersensor 445 located on one of the components in the group 460C of four.According to embodiments of the present invention, user 450 may choosethese three groups 460A, B and C because component 440 group 460A hasone type of component 440 or temperature limitation or both, group 460Bhas another type, and group 460C has another, as indicated in report420B due to a query via tool 415B performed by user 450.

Variations may exist regarding how close a temperature sensor must be inorder to be considered in “close proximity” in this context. However, incertain embodiments of the present invention a temperature sensor isconsidered sufficiently close proximity to a component 440 to provide areliable indication of temperature effects on the component 440 if thetemperature sensor is located within an area of two square inchessurrounding the component 440.

Also provided is a computerized monitoring/analysis device 510 runningmonitoring software module 515A and temperature sensitive componentanalysis software module 515B, which may be a plug in added to module515A according to embodiments of the present invention. Recall thatherein above it is disclosed that user 450 may select temperaturesensitive components 440 via query or sorting by scrub tool 415A and viacorresponding report 420B generated by scrub tool module 415B, whichadds reference designators for the respective components 440, accordingto embodiments of the present invention. Accordingly, for these user 450selected temperature sensitive components 440, module 515B receivesreference designators and temperature/time limits, such as by manualuser 450 input from report 420B.

From the foregoing it should be understood that part numbers andreference designators each serve different purposes, in at least somerespects, and may be used as described herein to cooperatively enabledifferent aspects of embodiments of the present invention. If aparticular part number is temperature sensitive, all component 440instances of that part number are temperature sensitive, regardless ofthe locations of those components 440 on PCBA 520. Thus, if file 427identifies part numbers that are deemed temperature sensitive for aparticular situation and identifies type of highlighting for each partnumber, this is sufficient information (without reference designators)for software tool 432 to communicate to enable program 430 toresponsively highlight all components 440 that are deemed temperaturesensitive for that situation, given that physical design data 430includes part numbers and the component 440 location of each partnumber. As previously explained, by causing physical design softwaretool 432 to highlight all the instances of components 440 of aparticular one or more part numbers on PCBA graphic representation 455,this allows a user to see where those particular part numbers arelocated, so the user can make decisions regarding where to best puttemperature sensors 445.

Reference designators, on the other hand, identify where individualcomponent 440 instances of a part number are located on a PCBA 520.Graphic representation 455 of PCBA 520 shows reference designators forcomponents 440. Also, scrub tool 415B adds reference designators toreport 420A, creating report 420B. Thus, graphic representation 455 bothreport 420B both provide reference designators for use in identifying aselected instance of a component 440 where a temperature sensor 445 isto be mounted, so that module 515B maps the sensed temperature to thatparticular one of the components 440. Likewise, reference designatorsare used herein to identify instances of other components 440 that areclose enough to the sensor 445 to be deemed a member of the same groupof components 440. A user 450 may refer to either graphic representation455 or report 420B or both to see reference designators. In manysituations user 450 will refer to reference designators on graphicrepresentation 455 to decide where to mount temperature sensors 445 andwhich components 440 to associate with respective sensors 445. However,report 420B further shows user 450 part numbers associated with thereference designators, which is uniquely useful in some circumstances.Report 420B may be used for screening prior to generating modifiedgraphic representation 455 showing highlighted temperature sensitivecomponents 440. For example, if only one component 440 is temperaturesensitive on a PCBA 520, then user 450 does not need to refer to graphic455 in order to select the component 440 on which to mount a sensor 445,so that user 450 does not need to use mapping tool 425 aspects thatgenerate a highlighted graphic 455. Also, by reference to report 420B,user 450 may see that one or more components 440 cannot possiblywithstand the manufacturing process, in which case user 450 mayimmediately initiate action to choose one or more different part numbersby notification and communication of the part number(s) and referencedesignator(s).

Device 510 is electrically connected to temperature sensors 445, whichprovide temperature measurement signals that are input to device 510.Device 510 is wired and located proximate to printed circuit boardassembly 520 while PCBA 520 undergoes the particular manufacturingprocess, such as SMT reflow in the exemplary instance. This may includePCBA 520 and device 510 riding into an oven or at least past a heatsource, such as on a conveyor, for example, according to the particularmanufacturing process. In an embodiment, device 510 may be tethered toPCBA 520, by the wiring or otherwise, such that device 510 is local toPCBA 520, such as within two meters, for example. It should beunderstood that although device 510 is not shown as awirelessly-connected, remote device in FIG. 4, in alternativeembodiments monitoring/analysis device 510 may be located remotely fromPCBA 520 as the PCBA 520 undergoes the manufacturing process, whereintransmitters (not shown) electrically coupled to temperature sensors 445are included on PCBA 520 for transmitting the temperature signals fromsensors 445 on PCBA 520 to remote device 510.

So that temperatures measured by respective sensors 445 are associatedwith respective corresponding components 440, module 515A is alsoconfigured to receive user 450 input indicating which temperature sensor445 input signal user 450 wants to correspond to which components 440.In certain embodiments of the present invention, components 440 to whichuser 450 associates temperature sensors 445 may be the most temperaturesensitive ones of components 440 for a particular manufacturing process.As previously described, these associations established by user 450 maybe based on physical positions of highlighted components 440 on PCBA 520as shown in depiction 455. Modules 515A and 515B are configured tosample the temperature signals from sensors 445 via hardware of tool510, which is done repeatedly throughout the manufacturing process, andare configured to record the measured temperatures and times. Module515B automatically determines respective results indicating for each ofthe most temperature sensitive components 440 whether the component 440was subjected in the manufacturing process to a temperature or times attemperature in excess of its specified permissible for that process.This may be done in real time, i.e., while PCBA 520 is subjected to themanufacturing process. For a given component 440 on a given PCBA 520that is being monitored for a particular manufacturing process, tool515B automatically makes the determination based on the measuredtemperature and time record for the temperature sensor 445 associatedwith the component 440 and based on module 515B comparingtemperature/time limit information for the component 440.

For example, the following illustrates a portion of a report generatedby analysis tool 515B showing i) input that analysis tool 515B obtainsas described herein above and ii) output that analysis tool 515Bgenerates by comparison of received temperature sensor 445 measurementsto associated component 440 temperature limit data, according toembodiments of the present invention:

Input Input Input Input Input Output Sensor RD Measured Parameter LimitActual Okay? 1 C101 Peak Temp 260 C. 265 C. No 1 C101 Time >217 C. 150 s186 s No 2 C120 Peak Temp 260 C. 245 C. Yes 2 C120 Time >217 C. 150 s118 s Yes 3 U100 Time within 5 C. of Peak  30 s  42 s No

Referring now to FIG. 5 in connection with FIG. 4, actions areillustrated in flowchart 600 that are performed, such as by the abovedescribed software or apparatus or both, according to embodiments of thepresent invention. A component engineer or similar technical person,e.g., a technical person engaged in manufacturing PCBA's, for example,generates 604 a smart questionnaire tool for receiving time andtemperature limit capability data for electronic components that willpopulate a PCBA, this includes programming 608 the tool with rules forevaluating the data, as will be explained further herein below. Then theengineer sends 612 the tool to a supplier or otherwise makes itavailable to the supplier, according to embodiments of the presentinvention. (Alternatively, the component engineer may use the toolinstead of sending it to a supplier.) The tool may include an onlineform that the supplier interacts with to enter data, where the toolevaluates the data entered by the supplier via an evaluation componentrunning on a computer that is remote from the supplier. Alternatively,the evaluation component runs on the supplier's computer. The form andthe evaluation component may be included in a stand-alone spreadsheetthat the supplier runs on the supplier's computer, for example.

The smart questionnaire tool receives 616 temperature and time limitsfor respective electronic component part numbers for loading into adatabase, such as a database maintained by the component engineer forthe PCBA manufacturer. For example, the smart questionnaire tool mayreceive the temperature and time limits from the supplier or thecomponent engineer may use the tool to enter the limits.

The smart questionnaire tool compares 620 the received temperature andtime limits to predetermined temperature and time limit requirementspre-programmed in the tool. That is, SQ evaluates whether time andtemperature limits entered by a user for a particular part number arewithin acceptable ranges, which it may do by comparing the entered timeand temperature limit values, which indicate capability of the componentto withstand heat up to those limits, to requirements for one or moremanufacturing processes.

The SQ also compares the entered values to one or more industry standardclassifications the user enters for the component. The industry standardmay apply to most electronic components, although it may provide aclassification for peak temperature based on component volume and area,since smaller devices tend to heat up more than those with largerthermal mass when subjected to same hot air convection during reflowoperation, for example. Generally, however, all other industry standardclassifications, other than peak reflow temperature, may apply to allelectronic devices.

As an example, the manufacturer may require a component to be capable ofwithstanding temperature above the melting point of (Pb-free solder),which is 217 C, for at least 150 seconds. This is a time and temperaturelimit capability for the component. So SQ compares a value entered to SQto this predetermined limit.

The smart questionnaire tool generates 624 an error message for the userif a value they entered for this capability is below 150 seconds. SQalso checks to see that one or more industry standard classificationrating that the user entered is correct for the time and temperaturelimit value they entered. For example, the J-STD-075 standard requiresthe supplier to classify their product stating how sensitive it is toassembly processes, including temperature, time, chemicals, etc. Theclassification is a 3 character code referred to as a PSL code. Thefirst is either a W or R, where W is for wave solder attach and R is forreflow solder attach. The second character is a number that correspondsto the peak temperature the device can withstand, where 1 is 275, 2 is270, 3 is 265, 4 is 260 c, and so on, and 0 is used if the device is notsensitive to its required peak temperature for its process and packagesize. The third character is a letter that is defined by what otherparameter(s) the device cannot meet. Some of the letters are tied to asingle process parameter; others are common combinations of parametersthat a package style cannot meet. Specifically, the following are thirdcharacters of a PSL code, according to the J-STD-075 standard:

-   -   A—Component has a Thermal Spike limitation.    -   C—Component has a Preheat limitation.    -   E—Component has a Time in Wave limitation.    -   F—Component has a Time (tL) Above 217° C. liquidous temperature        (TL) limitation.    -   N—Component has limitations: C; F; G and J.    -   P—Component has limitations: C; F; G and H.    -   Y—Component has additional limitations but the combination has        not been assigned a code. Details of these unique limitations        will need to be obtained from the Supplier. The letter Y is a        sort of catch-all for any combination that is not covered with        its own letter.

When receiving data by SQ for a device, after receiving some basicinformation about the device (like solder wave or convection reflowattach), SQ prompts the user to enter the PSL code and then the specificinformation about each of the requirements, if the device cannot meetone or more of the requirements specified in the SQ by the manufacturer.As a specific example, consider a situation in which a manufacturerrequirement preprogrammed in SQ (i.e., prior to receiving data entry forcomponents) was 150 seconds time above liquidous (“TAL”) temperature ofsolder (217 C), and the user enters data for the device indicating itcan only withstand 70 seconds. The user should also enter a character Ffor the industry classification PSL third character, to indicate thedevice has this TAL limitation. If the user enters a differentcharacter, other than F for this third character, SQ informs the userentering data that there is an error. For example, for an SQ embodiment,the user enters data into a spreadsheet preprogrammed with the rules forchecking data entry as described herein above and if the user entersdata in a line of the spreadsheet that violates a rule, the spreadsheetgenerates red text next to that line in the spreadsheet and on a checkpage.

In another example of how SQ may be used, a manufacturing requirementmay specify that the TAL capability of a device may be below a certaintime limit if certain steps are taken regarding a differentmanufacturing process requirement. For example, if the TAL capability ofa device is below a certain manufacturing limit, the TAL duration may beincreased if manufacturing lowers the peak temperature below sometemperature limit.

For example, if the TAL capability of a device is below a certainmanufacturing limit, the supplier may enter a new TAL durationcapability for the device based on a lower peak temperature duringmanufacturing. If the device has a peak temperature withstand capabilitythat is already above the manufacturer's required minimum, for example,the supplier may determine a new, lower peak temperature to specify inSQ for the part that is still above the manufacturer's minimum requiredpeak temperature limit, where the lower specified peak temperatureraises the TAL capability of the device to above the manufacturer'sminimum TAL limit. Or the manufacturer may specify a peak temperaturecapability for the part that is below the manufacturer's requiredminimum, in order to raise the supplier's specified TAL capability, andlet the manufacturer decide if the manufacturer can reasonably lower thepeak temperature in manufacturing.

In addition to SQ being programmed with requirements for industrystandard J-STD-075, which covers when components are originally solderedto a PCBA, SQ is also programmed with additional, post-attachrequirements, which are requirements for after components are solderedto the PCBA, including rework, bake the card for other operations, etc.

The smart questionnaire tool loads 628 temperature and time limits forrespective electronic component part numbers into the database. This maybe by loading a computer readable file generated by the tool when thesupplier entered data, such as, for example, a spreadsheet file.

In order for a scrub tool to receive a list of part numbers forelectronic components of a PCBA, a module of the scrub tool extractspart numbers of components for the PCBA from BOM computer readable datafor the PCBA and communicates them to another component of the scrubtool. Alternatively, a user may manually extract the part number listfrom the BOM and generate a file for the list. Either way, the list isreceived 636 by the scrub tool. The scrub tool sends 640 at least onequery for the part numbers to the database. The one or more queries areconfigured for finding, in the database, temperature and time limits ofthe electronic components having the part numbers of the list.

For the query result, the scrub tool generates 644 a report that liststhe part numbers of the list and the time and temperature limitcapabilities of the parts.

A module of the scrub tool extracts 648 reference designators ofcomponents for the PCBA from computer readable data for a BOM for thePCBA and merges the reference designators into the report generated at644.

A user makes a selection 656 of one or more part numbers found by theone or more queries in the database, where the selection is responsiveto the temperature and time limits shown in either or both of thereports and sends 660 the selected part numbers to a mapping tool, whichreceives the selection at 662. The mapping tool generates a datastructure from the received list of one or more selected part numbersthat is a compatible structure the user analyzes 666 communicating witha physical design tool of the computer system, wherein the physicaldesign tool is configured with physical design data for generating agraphic representation of the PCBA, including representation ofcomponents on the PCBA. The mapping tool sends 664 the data structure tothe physical design tool. Thus, the data structure from the mapping toolprovides the received selection of one or more part numbers andconfigures the physical design tool to responsively highlight on thePCBA graphic representation components having the one or more of thepart numbers of the selection.

The user analyzes 666 the PCBA graphic representation presented by thephysical design tool, which shows the locations of components identifiedby their reference designators. In performing this analysis, the useralso refers to the modified report generated at 648, which shows thereference designators and time and temperature limitations forcomponents on the PCBA. Based on the analysis, the user sends 668 areference designator of a component that the user selects for mounting atemperature sensor, referred further to herein as a “mounting”component. An analysis module of the computer system receives 670 eachreference designator of highlighted components selected by the user asmounting components. Each respective mounting component is for mountinga respective temperature sensor. The analysis module associates 672 eachrespective mounting component to a respective temperature sensorresponsive to the received reference designators.

For each mounting component, the user also makes a selection 676 of oneor more additional ones of the highlighted components and sends this tothe analysis module. The selection 676 is responsive to where the one ormore additional ones of the highlighted components are located on thePCBA relative to the respective mounting component with its temperaturesensor mounted thereon. Thus, for each respective temperature sensor,the analysis module receives 680 a selection of one or more additionalones of the highlighted components for association with the respectivetemperature sensor and associates 682 the one or more additional ones ofthe highlighted components with the respective temperature sensorresponsive to the received user selection of the one or more additionalones of the highlighted components.

The temperature sensors generate 684 signals received by a monitoringmodule when the PCBA is heated in a manufacturing process, and themonitoring module sends the data for the respective signals to theanalysis module, thereby indicating temperatures encountered by therespective temperature sensors. The analysis module receives 686 thedata from the monitoring module for respective signals generated by therespective temperature sensors and compares 688 the temperatureencountered by each respective temperature sensor to the time andtemperature limits of the one or more electronic components associatedwith the respective temperature sensor. Responsive to the comparing, theanalysis module sends 690 a thermal indication for showing whether anyof the time and temperature limits were exceeded during themanufacturing process.

Regarding FIG. 1, a pictorial representation of a network dataprocessing system 100 is shown in which the present invention may beimplemented. Network data processing system 100 contains a network 102,which is the medium used to provide communications links between variousdevices and computers connected together within network data processingsystem 100. Network 102 may include connections, such as wire, wirelesscommunication links, or fiber optic cables etc.

In the depicted example, server 104 is connected to network 102 alongwith storage unit 106. In addition, clients 108, 110, and 112 areconnected to network 102. These clients 108, 110, and 112 may be, forexample, personal computers or network computers. In the depictedexample, server 104 provides data, such as boot files, operating systemimages, and applications to clients 108, 110 and 112. Clients 108, 110and 112 are clients to server 104. Network data processing system 100may include additional servers, clients, and other devices not shown. Inthe depicted example, network data processing system 100 is the Internetwith network 102 representing a worldwide collection of networks andgateways that use the TCP/IP suite of protocols to communicate with oneanother.

Referring to FIG. 2, a block diagram of a data processing system thatmay be implemented as a server, such as server 104 in FIG. 1, isdepicted in accordance with a preferred embodiment of the presentinvention. Data processing system 200 may be a symmetric multiprocessor(SMP) system including a plurality of processors 202 and 204 connectedto system bus 206. Alternatively, a single processor system may beemployed. Also connected to system bus 206 is memory controller/cache208, which provides an interface to local memory 209. I/O bus bridge 210is connected to system bus 206 and provides an interface to I/O bus 212.Memory controller/cache 208 and I/O bus bridge 210 may be integrated asdepicted.

Peripheral component interconnect (PCI) bus bridge 214 connected to I/Obus 212 provides an interface to PCI local bus 216. A number of modemsmay be connected to PCI local bus 216. Typical PCI bus implementationswill support one or more PCI expansion slots or add-in connectors.Communications links to network computers 108, 110 and 112 in FIG. 1 maybe provided through modem 218 and network adapter 220 connected to PCIlocal bus 216 through add-in boards. Additional PCI bus bridges 222 and224 provide interfaces for additional PCI local buses 226 and 228, fromwhich additional modems or network adapters may be supported. In thismanner, data processing system 200 allows connections to multiplenetwork computers. A memory-mapped graphics adapter 230 and hard disk232 may also be connected to I/O bus 212 as depicted, either directly orindirectly.

Those of ordinary skill in the art will appreciate that the hardwaredepicted in FIG. 2 may vary. For example, other peripheral devices, suchas optical disk drives and the like, also may be used in addition to orin place of the hardware depicted. The depicted example is not meant toimply architectural limitations with respect to the present invention.

The data processing system depicted in FIG. 2 may be, for example, anIBM® eServer™ series system, running the IBM® AIX® operating system orLINUX® operating system. (IBM, eServer and AIXZ are trademarks ofInternational Business Machines Corporation, registered in manyjurisdictions worldwide. Linux is a registered trademark of LinusTorvalds in the United States, other countries, or both.)

With reference now to FIG. 3, a block diagram illustrating a dataprocessing system is depicted in which in an embodiment of the inventionmay be implemented. Data processing system 300 is an example of a clientcomputer. Data processing system 300 employs a peripheral componentinterconnect (PCI) local bus architecture. Although the depicted exampleemploys a PCI bus, other bus architectures such as Accelerated GraphicsPort (AGP) and Industry Standard Architecture (ISA) may be used.Processor 302 and main memory 304 are connected to PCI local bus 306through PCI bridge 308. PCI bridge 308 also may include an integratedmemory controller and cache memory for processor 302. Additionalconnections to PCI local bus 306 may be made through direct componentinterconnection or through add-in boards. In the depicted example, localarea network (LAN) adapter 310, Small computer system interface (SCSI)host bus adapter 312, and expansion bus interface 314 are connected toPCI local bus 306 by direct component connection. In contrast, audioadapter 316, graphics adapter 318, and audio/video adapter 319 areconnected to PCI local bus 306 by add-in boards inserted into expansionslots.

Expansion bus interface 314 provides a connection for a keyboard andmouse adapter 320, modem 322, and additional memory 324. SCSI host busadapter 312 provides a connection for hard disk drive 326, tape drive328, and CD-ROM drive 330. Typical PCI local bus implementations willsupport a plurality of PCI expansion slots or add-in connectors.

An operating system runs on processor 302 and is used to coordinate andprovide control of various components within data processing system 300in FIG. 3. The operating system may be any available operating system(commercial or open source). An object oriented programming system mayrun in conjunction with the operating system and provide calls to theoperating system from programs or applications executing on dataprocessing system 300. Instructions for the operating system, theobject-oriented operating system, and applications or programs arelocated on storage devices, such as hard disk drive 326, and may beloaded into main memory 304 for execution by processor 302.

Those of ordinary skill in the art will appreciate that the hardware inFIG. 3 may vary depending on the implementation. Other internal hardwareor peripheral devices, such as flash ROM (or equivalent nonvolatilememory) or optical disk drives and the like, may be used in addition toor in place of the hardware depicted in FIG. 3. Also, the processes ofthe present invention may be applied to a multiprocessor data processingsystem.

As another example, data processing system 300 may be a stand-alonesystem configured to be bootable without relying on some type of networkcommunication interface, whether or not data processing system 300comprises some type of network communication interface. As a furtherexample, data processing system 300 may be a Personal Digital Assistant(PDA) device, which is configured with ROM and/or flash ROM in order toprovide non-volatile memory for storing operating system files and/oruser-generated data.

The depicted example in FIG. 3 and above-described examples are notmeant to imply architectural limitations. For example, data processingsystem 300 may also be a notebook computer or hand held computer as wellas a PDA. Further, data processing system 300 may also be a kiosk or aWeb appliance.

The present invention may be a system, a method, and/or a computerprogram product. The computer program product may include a computerreadable storage medium (or media) having computer readable programinstructions thereon for causing a processor to carry out aspects of thepresent invention. The computer readable storage medium can be atangible device that can retain and store instructions for use by aninstruction execution device. The computer readable storage medium maybe, for example, but is not limited to, an electronic storage device, amagnetic storage device, an optical storage device, an electromagneticstorage device, a semiconductor storage device, or any suitablecombination of the foregoing. A non-exhaustive list of more specificexamples of the computer readable storage medium includes the following:a portable computer diskette, a hard disk, a random access memory (RAM),a read-only memory (ROM), an erasable programmable read-only memory(EPROM or Flash memory), a static random access memory (SRAM), aportable compact disc read-only memory (CD-ROM), a digital versatiledisk (DVD), a memory stick, a floppy disk, a mechanically encoded devicesuch as punch-cards or raised structures in a groove having instructionsrecorded thereon, and any suitable combination of the foregoing. Acomputer readable storage medium, as used herein, is not to be construedas being transitory signals per se, such as radio waves or other freelypropagating electromagnetic waves, electromagnetic waves propagatingthrough a waveguide or other transmission media (e.g., light pulsespassing through a fiber-optic cable), or electrical signals transmittedthrough a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network may comprisecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device.

Computer readable program instructions for carrying out operations ofthe present invention may be assembler instructions,instruction-set-architecture (ISA) instructions, machine instructions,machine dependent instructions, microcode, firmware instructions,state-setting data, or either source code or object code written in anycombination of one or more programming languages, including an objectoriented programming language such as Smalltalk, C++ or the like, andconventional procedural programming languages, such as the “C”programming language or similar programming languages. The computerreadable program instructions may execute entirely on the user'scomputer, partly on the user's computer, as a stand-alone softwarepackage, partly on the user's computer and partly on a remote computeror entirely on the remote computer or server. In the latter scenario,the remote computer may be connected to the user's computer through anytype of network, including a local area network (LAN) or a wide areanetwork (WAN), or the connection may be made to an external computer(for example, through the Internet using an Internet Service Provider).In some embodiments, electronic circuitry including, for example,programmable logic circuitry, field-programmable gate arrays (FPGA), orprogrammable logic arrays (PLA) may execute the computer readableprogram instructions by utilizing state information of the computerreadable program instructions to personalize the electronic circuitry,in order to perform aspects of the present invention.

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems), and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer readable program instructions.

These computer readable program instructions may be provided to aprocessor of a general purpose computer, special purpose computer, orother programmable data processing apparatus to produce a machine, suchthat the instructions, which execute via the processor of the computeror other programmable data processing apparatus, create means forimplementing the functions/acts specified in the flowchart and/or blockdiagram block or blocks. These computer readable program instructionsmay also be stored in a computer readable storage medium that can directa computer, a programmable data processing apparatus, and/or otherdevices to function in a particular manner, such that the computerreadable storage medium having instructions stored therein comprises anarticle of manufacture including instructions which implement aspects ofthe function/act specified in the flowchart and/or block diagram blockor blocks.

The computer readable program instructions may also be loaded onto acomputer, other programmable data processing apparatus, or other deviceto cause a series of operational steps to be performed on the computer,other programmable apparatus or other device to produce a computerimplemented process, such that the instructions which execute on thecomputer, other programmable apparatus, or other device implement thefunctions/acts specified in the flowchart and/or block diagram block orblocks.

The flowchart and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods, and computer program products according to variousembodiments of the present invention. In this regard, each block in theflowchart or block diagrams may represent a module, segment, or portionof instructions, which comprises one or more executable instructions forimplementing the specified logical function(s). In some alternativeimplementations, the functions noted in the block may occur out of theorder noted in the figures. For example, two blocks shown in successionmay, in fact, be executed substantially concurrently, or the blocks maysometimes be executed in the reverse order, depending upon thefunctionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware-based systems that perform the specifiedfunctions or acts or carry out combinations of special purpose hardwareand computer instructions.

One or more databases may be included in a host for storing andproviding access to data for the various implementations. One skilled inthe art will also appreciate that, for security reasons, any databases,systems, or components of the present invention may include anycombination of databases or components at a single location or atmultiple locations, wherein each database or system includes any ofvarious suitable security features, such as firewalls, access codes,encryption, de-encryption and the like.

The database may be any type of database, such as relational,hierarchical, object-oriented, and/or the like. A database product thatmay be used to implement the databases is IBM® DB2®, or other availabledatabase products. (IBM and DB2 are trademarks of International BusinessMachines Corporation, registered in many jurisdictions worldwide.) Thedatabase may be organized in any suitable manner, including as datatables or lookup tables.

The host may provide a suitable website or other internet-basedgraphical user interface accessible by users. In one embodiment,Netscape web server, IBM® Websphere® Internet tools suite, an IBM DB2,universal database platform and a Sybase database platform are used inconjunction with a Sun Solaris operating system platform. (IBM andWebSphere are trademarks of International Business Machines Corporation,registered in many jurisdictions worldwide.) Additionally, componentssuch as JBDC drivers, IBM connection pooling and IBM MQ seriesconnection methods may be used to provide data access to severalsources. The term webpage as it is used herein is not meant to limit thetype of documents and applications that might be used to interact withthe user. For example, a typical website might include, in addition tostandard HTML documents, various forms, applets, scripts, extensiblemarkup language (XML), dynamic HTML, cascading style sheets (CSS),helper applications, plug-ins, and the like.

Association of certain data may be accomplished through any dataassociation technique known and practiced in the art. For example, theassociation may be accomplished either manually or automatically.Automatic association techniques may include, for example, a databasesearch, a database merge, GREP, AGREP, SQL, and/or the like. Theassociation step may be accomplished by a database merge function, forexample, using a key field in each of the manufacturer and retailer datatables. A key field partitions the database according to the high-levelclass of objects defined by the key field. For example, a certain classmay be designated as a key field in both the first data table and thesecond data table, and the two data tables may then be merged on thebasis of the class data in the key field. In this embodiment, the datacorresponding to the key field in each of the merged data tables ispreferably the same. However, data tables having similar, though notidentical, data in the key fields may also be merged by using AGREP, forexample.

As used herein, the terms comprises, comprising, or any other variationthereof, are intended to cover a non-exclusive inclusion, such that aprocess, method, article, or apparatus that comprises a list of elementsdoes not include only those elements but may include other elements notexpressly listed or inherent to such process, method, article, orapparatus. Further, no element described herein is required for thepractice of the invention unless expressly described as essential orcritical.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed.

It should be appreciated that the particular implementations shown anddescribed herein are illustrative of the invention and its best mode andare not intended to otherwise limit the scope of the present inventionin any way. Other variations are within the scope of the followingclaims. Those skilled in the art having read this disclosure willrecognize that changes and modifications may be made to the embodimentswithout departing from the scope of the present invention.

While this specification contains many specifics, these should not beconstrued as limitations on the scope of the invention or of what can beclaimed, but rather as descriptions of features specific to particularimplementations of the invention. Certain features that are described inthis specification in the context of separate implementations can alsobe implemented in combination in a single implementation. Conversely,various features that are described in the context of a singleimplementation can also be implemented in multiple implementationsseparately or in any suitable sub combination. Moreover, althoughfeatures can be described above as acting in certain combinations andeven initially claimed as such, one or more features from a claimedcombination can in some cases be excised from the combination, and theclaimed combination can be directed to a subcombination or variation ofa subcombination.

Similarly, while operations are depicted in the drawings in a particularorder, this should not be understood as requiring that such operationsbe performed in the particular order shown or in sequential order, orthat all illustrated operations be performed, to achieve desirableresults. In certain circumstances, multitasking and parallel processingcan be advantageous. Moreover, the separation of various systemcomponents in the implementations described above should not beunderstood as requiring such separation in all implementations, and itshould be understood that the described program components and systemscan generally be integrated together in a single software product orpackaged into multiple software products.

Benefits, other advantages, and solutions to problems have beendescribed above with regard to specific embodiments. However, thebenefits, advantages, solutions to problems, and any element(s) that maycause any benefit, advantage, or solution to occur or become morepronounced are not to be construed as critical, required, or essentialfeatures or elements of any or all the claims.

What is claimed is:
 1. A method for a printed circuit board assembly(“PCBA”) having electronic components, the method comprising:highlighting, on a display of a computer system, selected electroniccomponents on a graphic representation of the PCBA, wherein the selectedcomponents are selected responsive to temperature and time limits of theselected components; associating ones of the highlighted components torespective temperature sensors on the PCBA; associating one or moreadditional ones of the highlighted components with at least one of therespective temperature sensors responsive to where the one or moreadditional ones of the highlighted components are located on the PCBArelative to the at least one of the respective temperature sensors;receiving data by the computer system for respective signals indicatingtemperatures encountered by the respective temperature sensors when thePCBA is heated in a manufacturing process; and showing by the computersystem whether any of the time and temperature limits were exceededduring the manufacturing process, permitting use of a reduced number oftemperature sensors in monitoring the heating of the PCBA during themanufacturing process, due to increased coverage of the temperaturesensors.
 2. The method of claim 1 wherein showing by the computer systemwhether any of the time and temperature limits were exceeded during themanufacturing process comprises: showing on the graphic representationof the PCBA whether any of the time and temperature limits were exceededduring the manufacturing process.
 3. The method of claim 1 comprising:receiving, by a scrub tool of the computer system, a list of partnumbers for the electronic components of the PCBA; and sending one ormore queries to a database by the scrub tool, wherein the one or morequeries are configured for finding temperature and time limits of theelectronic components having the part numbers of the list.
 4. The methodof claim 3, wherein, for the highlighting selected ones of thecomponents graphic representation of the PCBA, the method comprises:receiving, by a mapping tool of the computer system, a selection of oneor more part numbers found in the database responsive to the one or morequeries, wherein the selection is responsive to the temperature and timelimits.
 5. The method of claim 4, wherein for the highlighting selectedones of the components graphic representation of the PCBA, the methodcomprises: sending a data structure from the mapping tool to a physicaldesign tool of the computer system, wherein the physical design tool isconfigured with physical design data for generating a graphicrepresentation of the PCBA, including representation of components onthe PCBA, and wherein the data structure from the mapping tool providesthe received selection of one or more part numbers and configures thephysical design tool to responsively highlight on the PCBA graphicrepresentation components having the one or more of the part numbers ofthe selection.
 6. The method of claim 3, comprising: loading temperatureand time limits for respective electronic component part numbers intothe database from computer readable forms by a smart questionnaire toolof the computer system; extracting, by a module of the scrub tool,reference designators of components for the PCBA from computer readabledata for a bill of materials for the PCBA; and merging, by the module ofthe scrub tool, the reference designators into a report of thetemperature and time limits for the one or more part numbers found inthe database.
 7. The method of claim 1, wherein for the associating onesof the highlighted components to respective temperature sensors on thePCBA, the method comprises: receiving, by an analysis module of thecomputer system, reference designators of highlighted componentsselected by the user as mounting components, wherein each respectivemounting component is for mounting a respective temperature sensor andwherein the analysis module associates each respective mountingcomponent to a respective temperature sensor responsive to the receivedreference designators.
 8. A system for a printed circuit board assembly(“PCBA”) having electronic components, the system comprising: aprocessor; and computer readable storage media having instructionsstored thereon for execution by the processor, wherein the instructionsexecuted by the processor cause the processor to perform operationscomprising: highlighting, on a display of a computer system, selectedelectronic components on a graphic representation of the PCBA, whereinthe selected components are selected responsive to temperature and timelimits of the selected components; associating ones of the highlightedcomponents to respective temperature sensors on the PCBA; associatingone or more additional ones of the highlighted components with at leastone of the respective temperature sensors responsive to where the one ormore additional ones of the highlighted components are located on thePCBA relative to the at least one of the respective temperature sensors;receiving data by the computer system for respective signals indicatingtemperatures encountered by the respective temperature sensors when thePCBA is heated in a manufacturing process; and showing by the computersystem whether any of the time and temperature limits were exceededduring the manufacturing process, permitting use of a reduced number oftemperature sensors in monitoring the heating of the PCBA during themanufacturing process, due to increased coverage of the temperaturesensors.
 9. The system of claim 8 wherein showing by the computer systemwhether any of the time and temperature limits were exceeded during themanufacturing process comprises: showing on the graphic representationof the PCBA whether any of the time and temperature limits were exceededduring the manufacturing process.
 10. The system of claim 8, wherein theinstructions executed by the processor cause the processor to performoperations comprising: receiving, by a scrub tool of the computersystem, a list of part numbers for the electronic components of thePCBA; and sending one or more queries to a database by the scrub tool,wherein the one or more queries are configured for finding temperatureand time limits of the electronic components having the part numbers ofthe list.
 11. The system of claim 10, wherein, for the highlightingselected ones of the components graphic representation of the PCBA, theinstructions executed by the processor cause the processor to performoperations comprising: receiving, by a mapping tool of the computersystem, a selection of one or more part numbers found in the databaseresponsive to the one or more queries, wherein the selection isresponsive to the temperature and time limits.
 12. The system of claim11, wherein for the highlighting selected ones of the components graphicrepresentation of the PCBA, the instructions executed by the processorcause the processor to perform operations comprising: sending a datastructure from the mapping tool to a physical design tool of thecomputer system, wherein the physical design tool is configured withphysical design data for generating a graphic representation of thePCBA, including representation of components on the PCBA, and whereinthe data structure from the mapping tool provides the received selectionof one or more part numbers and configures the physical design tool toresponsively highlight on the PCBA graphic representation componentshaving the one or more of the part numbers of the selection.
 13. Thesystem of claim 10, the instructions executed by the processor cause theprocessor to perform operations comprising: loading temperature and timelimits for respective electronic component part numbers into thedatabase from computer readable forms by a smart questionnaire tool ofthe computer system; extracting, by a module of the scrub tool,reference designators of components for the PCBA from computer readabledata for a bill of materials for the PCBA; and merging, by the module ofthe scrub tool, the reference designators into a report of thetemperature and time limits for the one or more part numbers found inthe database.
 14. The system of claim 8, wherein for the associatingones of the highlighted components to respective temperature sensors onthe PCBA, the instructions executed by the processor cause the processorto perform operations comprising: receiving, by an analysis module ofthe computer system, reference designators of highlighted componentsselected by the user as mounting components, wherein each respectivemounting component is for mounting a respective temperature sensor andwherein the analysis module associates each respective mountingcomponent to a respective temperature sensor responsive to the receivedreference designators.
 15. A computer program product for a printedcircuit board assembly (“PCBA”) having electronic components, thecomputer program product including a computer readable storage mediumhaving instructions stored thereon for execution by a computer, whereinthe instructions, when executed by the computer, cause the computer toperform operations comprising: highlighting, on a display of a computersystem, selected electronic components on a graphic representation ofthe PCBA, wherein the selected components are selected responsive totemperature and time limits of the selected components; associating onesof the highlighted components to respective temperature sensors on thePCBA; associating one or more additional ones of the highlightedcomponents with at least one of the respective temperature sensorsresponsive to where the one or more additional ones of the highlightedcomponents are located on the PCBA relative to the at least one of therespective temperature sensors; receiving data by the computer systemfor respective signals indicating temperatures encountered by therespective temperature sensors when the PCBA is heated in amanufacturing process; and showing by the computer system whether any ofthe time and temperature limits were exceeded during the manufacturingprocess, permitting use of a reduced number of temperature sensors inmonitoring the heating of the PCBA during the manufacturing process, dueto increased coverage of the temperature sensors.
 16. The computerprogram product of claim 15 wherein showing by the computer systemwhether any of the time and temperature limits were exceeded during themanufacturing process comprises: showing on the graphic representationof the PCBA whether any of the time and temperature limits were exceededduring the manufacturing process.
 17. The computer program product ofclaim 15, wherein the instructions, when executed by the computer, causethe computer to perform operations comprising: receiving, by a scrubtool of the computer system, a list of part numbers for the electroniccomponents of the PCBA; and sending one or more queries to a database bythe scrub tool, wherein the one or more queries are configured forfinding temperature and time limits of the electronic components havingthe part numbers of the list.
 18. The computer program product of claim17, wherein, for the highlighting selected ones of the componentsgraphic representation of the PCBA, the instructions, when executed bythe computer, cause the computer to perform operations comprising:receiving, by a mapping tool of the computer system, a selection of oneor more part numbers found in the database responsive to the one or morequeries, wherein the selection is responsive to the temperature and timelimits.
 19. The computer program product of claim 18, wherein for thehighlighting selected ones of the components graphic representation ofthe PCBA, the instructions, when executed by the computer, cause thecomputer to perform operations comprising: sending a data structure fromthe mapping tool to a physical design tool of the computer system,wherein the physical design tool is configured with physical design datafor generating a graphic representation of the PCBA, includingrepresentation of components on the PCBA, and wherein the data structurefrom the mapping tool provides the received selection of one or morepart numbers and configures the physical design tool to responsivelyhighlight on the PCBA graphic representation components having the oneor more of the part numbers of the selection.
 20. The computer programproduct of claim 15, wherein for the associating ones of the highlightedcomponents to respective temperature sensors on the PCBA, theinstructions, when executed by the computer, cause the computer toperform operations comprising: receiving, by an analysis module of thecomputer system, reference designators of highlighted componentsselected by the user as mounting components, wherein each respectivemounting component is for mounting a respective temperature sensor andwherein the analysis module associates each respective mountingcomponent to a respective temperature sensor responsive to the receivedreference designators.